Qualcomm’s upcoming Snapdragon 895/898 tests show 20% performance improvement
Qualcomm’s Snapdragon 888 runs pretty hot, even wildly so under some circumstances on some phones. The Snapdragon 865/865+/870 family doesn’t have this problem, on the other hand. If you were expecting the next generation of Qualcomm’s top of the line chipsets to be cooler than the 888, well, you might be in for a surprise.
According to a rumor out of China, the first testing of samples using Samsung’s 4nm litography shows a 20% improvement in performance for the upcoming chip, which has the model number SM8450 and may be branded as either Snapdragon 895 or 898… or who knows what else. For the sake of sanity we’ll call it 895, but don’t take this to mean we know for sure that’s what it will end up being named.
While that performance improvement (supposedly compared to either the 888 or the 888+) is obviously a welcome development, there’s a flip side to this coin, and that is that the new chip runs hot too. We don’t have any more details, unfortunately, and this is early samples testing anyway, so things may improve significantly between now and November/December when the first chips are expected to be shipped to customers.